Computer Modeling and Design Aids
Accomplishments of Previous Projects:
- Information has been generated to assist in providing better ejector side die/platen support for reducing die distortion under load. The largest contributor to the ejector side separation is the unsupported span Characterized by the number, location and size of the pillar supports. Die thickness is the second most important factor. The platen thickness has a negligible effect on the ejector side separation. Major contributors to the cover side separation are the die footprint and platen thickness. The effect of die thickness on the cover side separation is small as compared to its effect on the ejector side. Productivity improvement opportunity!
Figure 4 – Die thickness and die length versus maximum ejector half separation plots for three-platen thicknesses.
- Enhancements to the flow and thermal visualizations have been made and a cooling line sketcher has been incorporated in the program. A modeling methodology has been defined which predicts casting distortion with reasonable accuracy.
- Guidance for the efficient use of modular dies is being developed to assist plants in enhancing their short run capability. A means to assess and enhance the size of the processing window for enhanced quality parts has been established. In addition, methods/suggestions on how to reduce runner volume are being developed.Productivity improvement opportunity!
Figure 5 – Example of how undercuts are flagged on a configuration through the part model to casting model conversion software
- Techniques to flag undercuts and surfaces needing draft have been developed. Current work is focused on automatic identification of sharp edges and conversion to radii.